Infinera and SIAE MICROELETTRONICA Demonstrate SDN-Enabled Multi-Domain Service Orchestration for 5G Networks

MILAN–(BUSINESS WIRE)–#5gbackhaul–Infinera (NASDAQ: INFN) and SIAE MICROELETTRONICA, a leader in wireless
communications, announced today the successful completion of end-to-end,
software-defined networking (SDN)-enabled service orchestration across
integrated IP/Multiprotocol Label Switching (MPLS) transport and
microwave/millimeter-wave transport domains. Conducted in collaboration
with a leading Tier 1 mobile operator, this proof of concept trial
showcased the ability of network operators to simplify and automate
multi-domain, multi-vendor operations as mobile networks evolve to
support new high-capacity, latency-sensitive 5G services.

The trial featured seamless interworking of the SIAE MICROELETTRONICA
SM-DC microwave domain controller, Infinera IP domain controller, SIAE
Layer3 microwave platform
, Infinera Transcend Orchestrator, and
Infinera 8600 Smart Router Series IP/MPLS platforms. Leveraging open,
standards-based application programming interfaces, the integrated
IP/MPLS and microwave transport solution provided a multi-domain,
multi-vendor framework for a wide variety of SDN-enabled service
creation and traffic management use cases, including:

  • Network and service discovery and visualization, including
    discovery of inventory of network elements, link topology (Layers
    0-3), and network services (Layers 2-3)
  • End-to-end multi-domain service provisioning, including Layer 2
    Ethernet pseudowire and Layer 3 IP virtual private networks over
    microwave links
  • Closed-loop automation and multi-domain optimization, including
    the automatic shaping of IP layer traffic based on microwave
    modulation and bandwidth changes

In addition to reducing operational expenses via simplified operations
and service provisioning, the integrated solution enables network
operators to reduce capital expenses by maximizing the utilization of
existing infrastructure as end-user capacity demands scale.

“This solution builds upon our widely deployed Tier 1 edge router
solutions and provides an easy way to improve operational efficiencies
with an evolutionary approach to SDN migration that leverages existing
infrastructure,” said Mikko Hannula, Vice President, Engineering and
Product Management at Infinera. “Our joint solution with SIAE
MICROELETTRONICA brings a new level of dynamic network optimization to
multi-domain, multi-layer, and multi-vendor networks while reinforcing
the operational benefits of open networking.”

“This implementation demonstrates how network resources can be addressed
to set up services in real time across different transport technologies
and network areas,” said Paolo Galbiati, Product Line Management
Director at SIAE MICROELETTRONICA. “This is proof of how SDN can really
serve operators in shaping their networks and fully exploiting network

leader in wireless communication technology, offering to operators
advanced solutions for microwave and millimeter-wave transport, services
and design. SIAE MICROELETTRONICA designs and produces its own RF
components, liaising over in-house RF lab, clean-room facilities and
complete product assembly with latest generation SMT smart-manufacturing
4.0 facility.

About Infinera
Infinera is a global supplier of innovative
networking solutions that enable carriers, cloud operators, governments
and enterprises to scale network bandwidth, accelerate service
innovation and automate network operations. The Infinera end-to-end
packet-optical portfolio delivers industry-leading economics and
performance in long-haul, subsea, data center interconnect and metro
transport applications. To learn more about Infinera visit,
follow us on Twitter @Infinera
and read our latest blog posts at

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